Double-sided multilayer CEM-3
Category: Standard circuit board
Product Details
CEM-3, a typical composite-type copper-clad laminate material, boasts wide-ranging application value in the electronics industry. Its key performance indicators—such as glass transition temperature (Tg), solderability, peel strength, and water absorption—are rigorously tested to ensure they fully meet the stringent standards set for FR-4 laminates. Specifically, CEM-3 maintains a stable glass transition temperature above 130°C, guaranteeing structural integrity even under high-temperature conditions. Additionally, it passes the 288°C solder immersion test for 10 seconds without exhibiting delamination or bubbling, demonstrating exceptional solder resistance. The material also achieves an industry-leading peel strength of over 1.8 N/mm, ensuring reliable adhesion between the circuit board and its substrate. In terms of electrical performance, CEM-3 exhibits an dielectric breakdown strength of at least 18 kV/mm and an insulation resistance exceeding 1 × 10¹² Ω, easily meeting the UL94 V-0 flame-retardant rating—performance levels comparable to those of FR-4 materials. Notably, CEM-3 differs significantly from FR-4 in several physical properties. First, its flexural strength is approximately 15%–20% lower than that of FR-4, primarily due to variations in glass fiber content and orientation. Thermally, CEM-3 has a longitudinal coefficient of thermal expansion (CTE) ranging from 18 to 22 ppm/°C, which is about 30% higher than FR-4’s 13–17 ppm/°C. This difference necessitates careful management of interlayer stresses during multilayer board fabrication. Despite these distinctions, CEM-3’s superior processing capabilities and cost-effectiveness make it an attractive alternative to FR-4, particularly in consumer electronics and communication devices where mechanical strength requirements are relatively modest. Moreover, CEM-3 excels in applications involving frequent bending or complex 3D shaping, offering enhanced formability and improved manufacturing efficiency compared to FR-4.
Features: Electrical performance is comparable to FR-4, and PTH reliability is on par with FR-4.
Applications: Instruments and meters, information appliances, automotive electronics, automatic controllers, gaming consoles, and more.
Common specifications: Base layer thickness: 1.0 mm, 1.5 mm; Copper foil thickness: 35 µm
Sheet material dimensions: 1044 x 1245 mm
Surface finishes: Tin plating, gold plating, OSP
Keywords: Double-sided multilayer CEM-3
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