Smart Terminal
Smart terminal products are evolving toward thinner, lighter, and more compact designs with integrated functionalities. The Internet of Everything is delivering entirely new user experiences, while biometric technologies and artificial intelligence are increasingly becoming essential components of these devices. Meanwhile, PCB technology is advancing from through-hole methods to localized buried vias, outer-layer blind vias, and even non-mechanical drilling techniques—driving circuits to become ever finer and enabling boards to achieve higher layer counts.
HDI printed circuit boards offer advantages such as high wiring density and flexible routing, enabling precise connections between components housed in ultra-small packages—making them a critical component for providing device interconnectivity in mobile terminals. Meanwhile, FPCs stand out for their lightweight design, thin profile, bendability, and exceptional flexibility, allowing them to endure millions of dynamic bending cycles without damaging the conductive traces. This unique capability makes it possible to achieve functional electrical connections within extremely compact spaces, enabling free movement or folding even in tightly constrained areas—and ultimately facilitating the creation of 3D components with intricate layouts.
Haiying's key technologies for smart terminal printed circuit boards:
- HDI/Anylayer/mSAP
- Precision wiring and multi-layer technology production capabilities
- Advanced SMT and back-end assembly equipment
- Exquisite craftsmanship
- Independent functional testing capability
- Low-loss substrate
- 5G antenna
Service knows no bounds.
We look forward to serving you.
Sichuan Haiying Electronic Technology Co., Ltd.
Address: No. 317, Mingxing Avenue, Chuanshan District, Suining City, Sichuan Province
Phone:0825-5819767
Email:hypcb@haiyingchina.com.cn
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