Manufacturing capability
The company focuses on enhancing product quality and upgrading production equipment, introducing multiple sets of manufacturing machinery that boast internationally advanced standards in the industry, along with automated and intelligent production support systems.
Currently, the company boasts advanced automated CNC drilling and milling precision machines equipped with integrated processing capabilities, multiple automated printing and baking inline production lines, as well as vertical and horizontal electroplating systems. Additionally, we have state-of-the-art equipment such as online AOI inspection, CCD exposure systems, LDI exposure technology, and four-wire low-resistance testing machines. These cutting-edge technologies enable seamless material handling with minimal human intervention, support wide-format, large-panel designs to boost productivity, allow real-time monitoring and measurement of semi-finished products, and ensure thorough pre-shipment testing of finished goods—laying a solid foundation for delivering high-quality, high-demand products.
Company equipment
List of some production equipment:
| Serial Number | Device Name | Model | Manufacturer |
| 1 | CNC Drilling Machine | D5L18E/H-MARK-10D | Shenzhen Dazhu CNC Technology Co., Ltd., Hitachi, Ltd. |
| 2 | Deburr | N92023 | Cosmic PCB Equipment Co., Ltd. |
| 3 | Konghua Line | 4195/R8 | Jingming Machinery (Shenzhen) Co., Ltd. |
| 4 | Layout Electroplating and Pattern Electroplating | 1497-R10 | Jingming Machinery (Shenzhen) Co., Ltd. |
| 5 | De-membrane, alkaline etching, lead-tin wire removal | 2287-P-01-A | Cosmic PCB Equipment Co., Ltd. |
| 6 | Acid corrosion, de-filming machine | 515-EH202 | Cosmic PCB Equipment Co., Ltd. |
| 7 | Electrolytic Cleaning Machine | CS-182W-24 | Cosmic PCB Equipment Co., Ltd. |
| 8 | Pumice Powder Cleaner | PUNEX-SHD/A | Cosmic PCB Equipment Co., Ltd. |
| 9 | Exposure machine | PC-130 | Zhi Sheng Industrial Co., Ltd. |
| 10 | Darkening Machine | Cosmic PCB Equipment Co., Ltd. | |
| 11 | Vacuum press, multi-layer press | MHKV100/10/6 | Changzhou Zhou's Electronic Equipment Co., Ltd. |
| 12 | Board Brushing Machine | ME/D/840.2/24/SS/M | Cosmic PCB Equipment Co., Ltd. |
| 13 | Screen printing machine | HYDRA | Taiwan Da Zhen Network Printing Machinery Equipment Co., Ltd. |
| 14 | Developer | 418-3 | Cosmic PCB Equipment Co., Ltd. |
| 15 | Precision Oven | SNO-8A | Zhi Sheng Industrial Co., Ltd. |
| 16 | Automatic Positioning Drilling Machine | NPX-808 | Changzhou Haitian Electronics Co., Ltd. |
| 17 | Hot Air Leveling Machine | PCL-90 | Baoding Landun Circuit Board Equipment Co., Ltd. |
| 18 | CNC milling machine | NR-4C18E, H-NARK-90 | Massive CNC Technology Co., Ltd. |
| 19 | Plug Nickel/Gold Plating Production Line | Asia Electroplating Equipment Co., Ltd. | |
| 20 | Automated Optical Inspection Machine | PL-1450 | Deltatek Electronics (Shenzhen) Co., Ltd. |
| 21 | Dual-sided Dedicated Light Plate Tester | LM-05 | Shenzhen Dazhu Mingxin Electronics Co., Ltd. |
| 22 | Test machine (single-sided) | MPP406-HV | Shenzhen Kehuilong Technology Co., Ltd. |
| 23 | Test machine (double-sided) | MPP4220/20 | Shenzhen Dazhu Mingxin Electronics Co., Ltd. |
| 24 | Multi-functional CNC V-Groove Cutting Machine | ALFAMAT-11 | Shanghai Zhongsi Electronic Equipment Co., Ltd. |
| 25 | Moisture Test Chamber | 120SB/+10JU/40DU | Guangdong Zhengye Technology Co., Ltd. |
| 26 | Temperature Shock Test System | PL-400 & PL-B119C | Guangdong Zhengye Technology Co., Ltd. |
| 27 | CAD System | 3224 | Taiwan Yongjia Industrial Co., Ltd. |
| 28 | Light Plotter | XPER1700 & P5008A | Taiwan Yongjia Industrial Co., Ltd. |
| 29 | Computer manufacturing systems and laser plotters | Dongfang Yu Zhi Guang Electronic Technology Co., Ltd. | |
| 30 | Pre-printing Cleaning Machine | Shenzhen Keludi PCB Machinery & Equipment Co., Ltd. | |
| 31 | Liquid Solder Mask Developer | Shenzhen Ronghua Kechuang Circuit Board Equipment Co., Ltd. |
Process Capability
Product Process Capability and Technical Standards
| Project / Item | Mass Production | Sample/Prototype |
| Surface Treatment | Tin Spray (Lead-Free Available) / HASL (LF) | Tin Spray (Lead-Free Available) / HASL (LF) |
| Immersion Gold | Immersion Gold | |
| Electroplated Gold / Flash Gold | Electroplated Gold / Flash Gold | |
| Antioxidant/OSP | Antioxidant/OSP | |
| Immersion Tin | Immersion Tin | |
| Immersion Silver | Immersion Silver | |
| Tin Spray + Gold Finger / HASL & Gold Finger | Tin Spray + Gold Finger / HASL & Gold Finger | |
| Selective nickel-gold / selective nickel | Selective nickel-gold / selective nickel | |
| Tin-plating (including lead-free) thickness | PAD size/SMT Pad: >3 µm | PAD size/SMT Pad: >4 µm |
| HASL (LF) | Big Copper Surface / Big Cu: >1 µm | Big Copper Surface / Big Cu: >1.5 µm |
| Immersion Tin | 0.4–0.8 µm | 0.8–1.2 µm |
| Immersion Gold | Nickel thickness/Ni: 2–5 µm | Nickel thickness/Ni: 3–6 µm |
| Gold Thickness/Au: 0.05–0.10 µm | Gold Thickness/Au: 0.075–0.15 µm | |
| Immersion Silver | 0.2–0.6 µm | 0.3–0.6 µm |
| Antioxidant/OSP | 0.1–0.4 µm | 0.25–0.4 µm |
| Electroplated Gold / Flash Gold | Nickel thickness/Ni: 3–6 µm | Nickel thickness/Ni: 3–6 µm |
| Gold Thickness/Au: 0.01–0.05 µm | Gold Thickness/Au: 0.02–0.075 µm | |
| Sheet Materials/Laminates | CEM-3, PTFE | CEM-3, PTFE |
| FR-4 (High-Tg, etc.) FR-4 (High-TG, etc.) | FR-4 (High-Tg, etc.) FR-4 (High-TG, etc.) | |
| Metal Base Substrate (Aluminum, Copper, etc.) | Metal Base Substrate (Aluminum, Copper, etc.) | |
| Rogors, etc. | Rogors, etc. | |
| Maximum Layers / Max Layers | 12 (Layers) | 18 (Layers) |
| Maximum layout size | 20" x 48" | 20" x 48" |
| Board Thickness | 0.4mm–4.0mm | <0.4 mm or >4.0 mm |
| Maximum Copper Thickness | Inner Layer: 4 oz | Inner Layer: 5oz |
| Outer Layer: 5oz | Outer Layer: 5oz | |
| Minimum Line Width / Min Track Width | 4 million / 0.1 mm | 3 million / 0.076 mm |
| Minimum Track Space | 4 million / 0.1 mm | 3 million / 0.076 mm |
| Minimum Drill Hole Diameter / Min Hole Size | 8 million / 0.2 mm | 6 million / 0.1 mm |
| Minimum Laser Drill Hole Diameter | 4 million / 0.1 mm | 3 million / 0.076 mm |
| Minimum Hole Wall Copper Thickness / PTH Wall Thickness | 0.8 million / 20 µm | 1.2 million / 30 µm |
| Aperture Tolerance / PTH Dia. Tolerance | ±3 mil / ±76 µm | ±2 mil / ±50 µm |
| Plate Thickness to Hole Diameter Ratio / Aspect Ratio | 6:1 | 10:1 |
| Impedance Control | ±10% | ±5% |
Processing Capacity
| Project | Processing Capacity | |
| Number of floors | Floors 1 to 16 | |
| Board Type | FR-1, CEM-1, CEM-3, FR-4, metal-based substrates, high-frequency materials, high-TG materials, halogen-free materials, and more | |
| Maximum size | 500mm x 800mm | |
| Dimensional Accuracy of External Shape | ±0.13 mm | |
| Plate thickness range | 0.20 mm to 6.00 mm | |
| Plate thickness tolerance | ±8% (t ≥ 0.8 mm) | |
| Plate thickness tolerance | ±10% (t < 0.8 mm) | |
| Media thickness | 0.075 mm to 5.00 mm | |
| Minimum line width | 0.10 mm | |
| Minimum trace spacing | 0.10 mm | |
| Outer layer copper thickness | 35–175mm | |
| Inner-layer copper thickness | 17 µm to 175 µm | |
| Drill hole diameter | 0.20–6.35 mm | Mechanical drill |
| Hole diameter | 0.15–6.30 mm | |
| Aperture Tolerance | 0.05 mm | |
| Hole Position Tolerance | 0.075mm | |
| Plate Thickness-to-Hole Diameter Ratio | 8:1 | |
| Solder Mask Type | Photosensitive ink, matte ink | |
| Minimum solder mask bridge width | 0.1mm | |
| Smallest solder mask isolation ring | 0.1mm | |
| Seal hole diameter | 0.25 mm to 0.60 mm | |
| Impedance Tolerance | ±10% | |
| Surface Treatment Type | Lead-based solder spray, lead-free solder spray, OSP, gold plating | |
Service knows no bounds.
We look forward to serving you.
Sichuan Haiying Electronic Technology Co., Ltd.
Address: No. 317, Mingxing Avenue, Chuanshan District, Suining City, Sichuan Province
Phone:0825-5819767
Email:hypcb@haiyingchina.com.cn
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