Single-sided aluminum substrate
Category: Metal substrate
Product Details
"Aluminum-based copper-clad laminates (commonly referred to as aluminum substrates) are a fundamental material widely used in the electronics industry. They are manufactured by combining an aluminum base with a copper-clad layer through a specialized manufacturing process. At the core of the aluminum substrate is high-quality, lightweight aluminum, which boasts exceptional thermal conductivity and impressive mechanical strength—making it an ideal choice for electronic devices that demand both efficient heat dissipation and robust structural support. Meanwhile, the copper-clad layer is crafted from high-purity electrolytic copper foil, securely bonded to the aluminum substrate via advanced thermal-pressing technology, creating a circuit carrier with outstanding electrical performance. This innovative composite structure not only retains aluminum’s superior heat-dissipating properties but also enhances its functionality with the addition of the copper layer, enabling highly efficient electrical conduction. As a result, it perfectly addresses the dual requirements of modern electronic devices: "heat management + electrical conductivity." In practical applications, aluminum substrates are frequently employed in the production of LED lighting fixtures, high-power power modules, automotive electronic control systems, and other scenarios where thermal management is critical. Their unique layered design efficiently transfers heat generated by components directly to cooling mechanisms, while simultaneously providing stable physical support for circuit layouts. Depending on specific application needs, aluminum substrates come in various types: - By insulation layer material, they can be categorized into options like epoxy glass cloth-based or polyester film-based substrates. - By copper foil thickness, they are available in specifications such as 1/2 OZ, 1 OZ, or 2 OZ. - By surface treatment processes, they include finishes like immersion gold, hot air solder leveling (HASL), or organic solderability preservative (OSP). These diverse classifications allow aluminum substrates to precisely meet the distinct technical demands of everything from consumer electronics to industrial-grade equipment. With the rapid growth of emerging industries such as 5G communications and next-generation electric vehicles, aluminum substrates—with their exceptional overall performance—are increasingly becoming the cornerstone material driving the evolution of electronic components toward miniaturization and higher power capabilities."
Features: The aluminum-based substrate offers excellent heat dissipation, electromagnetic shielding, insulation performance, and mechanical processing capabilities. It is ideal for surface-mounting power components, eliminating the need for a heatsink and significantly reducing the overall size.
Applications: 1. Power Hybrid IC (HIC)
2. Audio equipment: input and output amplifiers, balanced amplifiers, audio amplifiers, preamplifiers, power amplifiers, and more.
3. Communication and electronic devices: high-frequency amplifiers, filtering circuits, transmission circuits
4. Power supply devices: switching regulators, DC converters, SW regulators, and more.
5. Office automation equipment: electric actuators, etc.
6. Computer components: CPU board, floppy disk drive, power supply unit, and more.
7. Power modules: converters, solid-state relays, power supply units, and more.
8. LED Lighting: High-power LED lights, LED curtain walls, and more.
Common specifications: Metal base: 1.0mm, 1.2mm, 1.6mm, 2.0mm, 4.0mm; copper thickness: 35µm, 70µm, 105µm
Sheet dimensions: 500*1200mm, 600*1200mm, 1000*1200mm
Surface Finish: Rosin, Hot-Air Solder Leveling
Keywords: Single-sided aluminum substrate
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