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Carrier Plate for Components
As consumer electronics such as smartphones, tablets, and wearable devices continue to evolve toward greater intelligence, sleeker designs, and increasingly diverse functionalities, Haiying Electronics has proactively identified key technology trends and invested in building a factory in Zhuhai specializing in substrate-like boards and IC packaging substrates. This initiative enables significant technological advancements, including higher product stacking layers, finer line widths and spacings, and the ability to integrate more advanced functional modules.
The Zhuhai SLP factory primarily produces Anylayer boards, substrate-like boards, and IC packaging substrates, with the highest layer count reaching up to 16 layers. These products are widely used in consumer electronics (such as smartphones, wearables, tablets, cameras, and laptops), as well as in emerging fields like IoT, industrial control systems, and automotive electronics.
Product focus areas include: high-end HDI boards for smartphones and consumer applications, IC packaging substrates, automotive HDI boards, ≥100G communication optical module boards, and substrate-like boards.
HaiyingSLP's factory technical capabilities are as follows:
- Maximum number of layers: 16 layers, anylayer
- Applications of materials with low dielectric constant, low loss, and low thermal expansion coefficient
- Techniques: Subtractive Process, mSAP Process, amSAP Process
- Minimum 50µm laser holes
- Minimum 80µm solder mask opening
- Minimum line width/spacing: 30/30 µm
Service knows no bounds.
We look forward to serving you.
Sichuan Haiying Electronic Technology Co., Ltd.
Address: No. 317, Mingxing Avenue, Chuanshan District, Suining City, Sichuan Province
Phone:0825-5819767
Email:hypcb@haiyingchina.com.cn
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