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Radio Frequency Printed Circuit Board

A wide variety of electronic applications demands higher-frequency technical support. As frequencies increase, the margin for error or deviation in printed circuit boards must be minimized as much as possible. To meet these high-frequency requirements, it’s essential to use high-frequency substrates, incorporate blind-via technology, and maintain tight control over etching tolerances.

Haiying's technical capabilities are as follows:

  • Main processable materials: Hydrocarbons + ceramic filler, hydrocarbons + glass fiber fabric, PPO + filler, PTFE + ceramic filler; PTFE + glass fiber fabric
  • Outer layer graphic line width/line spacing etching tolerance ±18 µm
  • LDI laser direct imaging delivers exceptional graphic fidelity, ensuring superior simulation results for our customers.
  • Interlayer alignment accuracy: ±4 mil
  • Buried vias / Blind vias / Microvias
  • Mixed pressure
  • Major surface finishes: Immersion Tin, Immersion Silver, OSP, ENIG
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