High-Density Interconnect Board

HDI, or High-Density Interconnect, features micro-via holes ≤0.15mm in diameter, enabling the connection of components within extremely compact packages using advanced fine-line technology. With its compact geometric design, HDI achieves significantly higher wiring densities. By minimizing parasitic interference, reducing stub lengths to a minimum, eliminating decoupling capacitors, and lowering crosstalk levels, HDI dramatically enhances electrical performance. Additionally, the reduced spacing between ground layers results in denser distributed capacitance, further mitigating RFI and EMI for improved signal integrity.

Haiying's technical capabilities are as follows:

Increase line density
Favorable for the adoption of advanced packaging technologies
Any layer
mSAP
Advanced equipment
Minimum line width/gap: 0.04 mm / 0.04 mm
Maximum solder mask alignment tolerance: ±1 mil

Single-sided board

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Single-sided board

Service knows no bounds.

We look forward to serving you.

Sichuan Haiying Electronic Technology Co., Ltd.

Address: No. 317, Mingxing Avenue, Chuanshan District, Suining City, Sichuan Province
Phone:0825-5819767
Email:hypcb@haiyingchina.com.cn

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