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CEM-3 is a composite-type copper-clad laminate. It meets FR-4 standards in terms of glass transition temperature, solderability, peel strength, water absorption, dielectric breakdown, insulation resistance, and UL ratings. However, unlike FR-4, CEM-3 has lower flexural strength and higher thermal expansion.
FR-4 is the designation for a flame-retardant grade of glass-fiber reinforced epoxy resin copper-clad laminate, indicating that the resin material is designed to self-extinguish once combustion has begun.
Aluminum-based substrates offer excellent thermal dissipation, electromagnetic shielding, insulation properties, and machinability, making them ideal for surface-mounting power components—eliminating the need for bulky heat sinks and significantly reducing overall size.
Phenolic paper-based copper-clad laminates, used as the substrate for printed circuit boards, feature a flame-retardant rating of 94 HB.
Flame-retardant board, officially known as copper-clad phenolic resin paper-based laminated board, with a flame-retardancy rating of 94 V0.
CEM-1 epoxy paper-core glass cloth composite laminate, with a flame-retardant rating of 94 VO
14-layer board
12-layer board
Double-sided multilayer CEM-3